Electroless plating bath composition and method of use

Details Electroless plating bath composition and method of use Electroless plating bath composition and method of use

2011-01-25

2011-01-25

Klemanski, Helene (Department: 1793)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001270, C427S099500, C427S437000, C427S443100

Reexamination Certificate

active

07875110

ABSTRACT:
An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit cobalt metal in or on semiconductor substrate surfaces including vias, trenches, and interconnects.

REFERENCES:
patent: 3597267 (1971-08-01), Baudrand et al.
patent: 3627545 (1971-12-01), Baudrand et al.
patent: 4072781 (1978-02-01), Shirahata et al.
patent: 5364459 (1994-11-01), Senda et al.
patent: 5755859 (1998-05-01), Bruise et al.
patent: 5925415 (1999-07-01), Fry et al.
patent: 6146702 (2000-11-01), Zitko
patent: 6645567 (2003-11-01), Chebiam et al.
patent: 6716330 (2004-04-01), Hongo et al.
patent: 6717189 (2004-04-01), Inoue et al.
patent: 7098128 (2006-08-01), Collins et al.
patent: 7189626 (2007-03-01), Elkins et al.
patent: 7686874 (2010-03-01), Klein et al.
patent: 2004/0142114 (2004-07-01), Kong et al.
patent: 2004/0175509 (2004-09-01), Kolics et al.
patent: 2005/0006339 (2005-01-01), Mardilovich et al.
Pearlstein, F. et al., “Electroless Cobalt Deposition from Acid Baths,” J. Electrochem. Soc.: Electrochemical Science and Technology, Aug. 1974, vol. 121, No. 8, pp. 1023-1028.
Modern Electroplating, John Wiley & Sons, p. 731, no date available.
Electroless Plating: Fundamentals & Applications. American Electrolpaters and Surface Finishers Society, Inc., p. 486, no date available.
Modern Electroplating, 3rd edition 1974, pp. 718-719.
Electroless plating, Fundamentals and Applications, 1990, p. 318.

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