Heat exchange system

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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C165S080400, C165S080500

Reexamination Certificate

active

07921903

ABSTRACT:
A heat exchange system for electronic devices, preferably data processing devices which include high-performance processors or have a high processor density, includes essentially a primary cooling circuit and a secondary cooling circuit both being thermally associated to the one or more processor units. The secondary cooling circuit is configured as a completely closed system, the coolant in the secondary cooling circuit being driven exclusively by mechanical or inductive coupling with the flow drive of the primary cooling circuit.

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patent: 2003/0209343 (2003-11-01), Bingler
patent: 2004/0123614 (2004-07-01), Stewart
patent: 2006/0032625 (2006-02-01), Angelis et al.
patent: 103 44 699 (2004-04-01), None
patent: 0 582 217 (1994-02-01), None
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