Dynamic control of process chemistry for improved...

Details Dynamic control of process chemistry for improved... Dynamic control of process chemistry for improved...

2011-08-02

2011-08-02

Kackar, Ram (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C118S715000, C216S058000, C428S066400, C222S001000, C222S003000, C137S002000

Reexamination Certificate

active

07988813

ABSTRACT:
A method and system for dynamically controlling a process chemistry above a substrate is described. The system for adjusting the process chemistry comprises a ring configured to surround a peripheral edge of a substrate in a vacuum processing system. The ring comprises one or more gas distribution passages formed within the ring and configured to supply an additive process gas through an upper surface of the ring to the peripheral region of the substrate, wherein the one or more gas distribution passages are configured to be coupled to one or more corresponding gas supply passages formed within the substrate holder upon which the ring rests.

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