Wiring board and method of manufacturing wiring board

Details Wiring board and method of manufacturing wiring board Wiring board and method of manufacturing wiring board

2011-01-25

2011-01-25

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S761000, C361S760000, C361S808000, C361S811000, C174S261000, C174S262000, C174S256000

Reexamination Certificate

active

07876571

ABSTRACT:
A board comprises a cavity for placing an electronic component on a base, a pair of pads for mounting said electronic component, each of said pads is formed on said base, a pair of through holes piercing through said board from said base, each of said through holes includes a land, and wires which electrically connect said lands and said pads, respectively.

REFERENCES:
patent: 6229404 (2001-05-01), Hatanaka
patent: 6324067 (2001-11-01), Nishiyama
patent: 6627864 (2003-09-01), Glenn et al.
patent: 6734535 (2004-05-01), Hashimoto
patent: 6759266 (2004-07-01), Hoffman
patent: 2001/0042640 (2001-11-01), Nakamura et al.
patent: 2003/0171011 (2003-09-01), Li
patent: 10-22643 (1998-01-01), None
patent: 2004-342641 (2004-12-01), None

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