Semiconductor material manufacture

Details Semiconductor material manufacture Semiconductor material manufacture

2011-04-19

2011-04-19

Estrada, Michele (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S403000, C438S406000, C438S407000, C438S458000, C438S464000, C438S520000, C438S528000, C257SE21568

Reexamination Certificate

active

07927975

ABSTRACT:
Electronic apparatus, systems, and methods include a semiconductor layer bonded to a bulk region of a wafer or a substrate, in which the semiconductor layer can be bonded to the bulk region using electromagnetic radiation. Additional apparatus, systems, and methods are disclosed.

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