Selective plating apparatus

Details Selective plating apparatus Selective plating apparatus

1976-02-06

1977-09-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204202, 204DIG7, C25D 1728, C25D 502

Patent

active

040480437

ABSTRACT:
Apparatus and method for continuous electroplating of at least first and second selected portions of an electronic component or the like, while effecting differential plating thicknesses upon said portions. The apparatus includes means for moving the components through an electroplating station with the portions selected to be plated in contact with a moving applicator belt. Means are provided for shunting a portion of the plating current preceding toward at least one of the selected portions of the component, back to the source which enables the plating potential, whereby differential plating is effected between the first and second portions of the component.

REFERENCES:
patent: 2044415 (1936-06-01), Yates
patent: 2044431 (1936-06-01), Harrison
patent: 3880725 (1975-04-01), Van Raalte
patent: 3951772 (1976-04-01), Bick et al.
patent: 3966581 (1976-06-01), Holte

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