Integrated circuit packaging system with interposer

Details Integrated circuit packaging system with interposer Integrated circuit packaging system with interposer

2011-03-22

2011-03-22

Sandvik, Benjamin P (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23002, C257SE21705, C438S107000

Reexamination Certificate

active

07911046

ABSTRACT:
An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.

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