Precision optical sensor packaging

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

250216, 359626, G01J 142

Patent

active

058013741

ABSTRACT:
Conventional packaging of optical sensors is of little assistance in determining the location and attitude of the focal place of the sensor 10, since package tolerances lack the requisite precision. Each sensor 10 must be separately focused to its optical assembly 40. Such focusing is expensive, as is the package itself. This invention instead mounts the sensor 10 directly onto one face 28 of a transparent plate 18. Radiation is focused through the plate 18 and onto the sensor 10. Precision alignment targets 12, 22 are formed separately on the sensor 10 (providing a known location of the active image area 14 with respect to the target 12) and on the plate 18 (providing a known location of the edges 24 of the plate 18 with respect to the target 22). The targets 12, 22 are aligned, and contact pads 16, 30 on the sensor 10 and on the plate 18 are joined by electronically conductive bumps 36 of known thickness. The plate 18 itself is of known thickness. The location and attitude of the edges 24 of the plate 18, and of the opposite side 46 of the plate 18, may readily be determined, yet these locations and attitudes are all that is required to determine the location and attitude of the active image area 14, and thus to place the active image area 14 precisely in the focal plane of the optics 40. Moreover, microlenses 52 may be formed in the plate 18, one for each sensor cell 48 in the active image area 14, thereby greatly enhancing the light-gathering capacity of the sensor 10.

REFERENCES:
patent: 4695719 (1987-09-01), Wilwerding
patent: 5552596 (1996-09-01), Ravetto et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Precision optical sensor packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Precision optical sensor packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precision optical sensor packaging will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-271940

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.