Stacking semiconductor device and production method thereof

Details Stacking semiconductor device and production method thereof Stacking semiconductor device and production method thereof

2011-01-04

2011-01-04

Chu, Chris (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S121000, C438S457000, C257SE25013, C257S685000, C257S686000

Reexamination Certificate

active

07863101

ABSTRACT:
In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.

REFERENCES:
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6054759 (2000-04-01), Nakamura
patent: 6188127 (2001-02-01), Senba et al.
patent: 6239496 (2001-05-01), Asada
patent: 6265772 (2001-07-01), Yoshida
patent: 6316289 (2001-11-01), Chung
patent: 6410988 (2002-06-01), Caletka et al.
patent: 6960827 (2005-11-01), Nishimura et al.
patent: 7071028 (2006-07-01), Koike et al.
patent: 7091619 (2006-08-01), Aoyagi
patent: 7276784 (2007-10-01), Omizo et al.
patent: 7317247 (2008-01-01), Lee et al.
patent: 7635912 (2009-12-01), Ejima
patent: 7759799 (2010-07-01), Ejima
patent: 2004/0222510 (2004-11-01), Aoyagi
patent: 2004/0222519 (2004-11-01), Aoyagi
patent: 2004/0227236 (2004-11-01), Sawamoto
patent: 2005/0001301 (2005-01-01), Aoyagi
patent: 2007/0045788 (2007-03-01), Suzuki et al.
patent: 2007/0164445 (2007-07-01), Ejima
patent: 2009/0039490 (2009-02-01), Fan
patent: 2009/0102049 (2009-04-01), Murata et al.
patent: 2004-281919 (2004-10-01), None
patent: 2004-335603 (2004-11-01), None

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