Semiconductor integrated circuit wafer, semiconductor...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S762010, C324S762030

Reexamination Certificate

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07969169

ABSTRACT:
A semiconductor integrated circuit wafer includes: a plurality of semiconductor integrated circuit regions each of which includes a semiconductor integrated circuit formed thereon; a scribe region which separates the semiconductor integrated circuit regions adjacent to each other; a build in self test (BIST) circuit which is provided in the scribe region and inspects the semiconductor integrated circuit; a connection wiring which is formed ranging from the scribe region to the semiconductor integrated circuit region and connects the semiconductor integrated circuit and the BIST circuit; a BIST switching signal input pad which is provided in the semiconductor integrated circuit region; and a BIST switching circuit which is provided in the semiconductor integrated circuit region and is driven by a driving signal input from the BIST switching signal input pad, the BIST switching circuit including: an input-output pad which connects with the semiconductor integrated circuit; a circuit wiring which connects the input-output pad with the semiconductor integrated circuit; and a switch element which is provided at a middle position of the circuit wiring and is driven by the driving signal input from the BIST switching signal input pad.

REFERENCES:
patent: 5929650 (1999-07-01), Pappert et al.
patent: 7057409 (2006-06-01), Wills
patent: 2001-085479 (2001-03-01), None
patent: 2002-176140 (2002-06-01), None
patent: 2003-124275 (2003-04-01), None

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