Multi-host interface controller with USB PHY/analog...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257S686000, C257SE25005, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

07898091

ABSTRACT:
In a first embodiment, an apparatus and a method of fabrication thereof includes a substrate, a controller formed on a first integrated circuit (IC) die and disposed on the substrate, a second IC die embodying circuitry configured to enable communication between the controller and an external device, first I/O pads disposed on the first IC die, second I/O pads disposed on the second IC die, wire bonding interconnections coupling at least one of the first I/O pads with at least one of the second I/O pads, and a memory array formed on a third IC die and configured to enable communication with the controller. In a second embodiment the memory array is alternatively integrated into the first IC die.

REFERENCES:
patent: 6414384 (2002-07-01), Lo et al.
patent: 6492727 (2002-12-01), Nishizawa et al.
patent: 7345361 (2008-03-01), Mallik et al.
patent: 7576433 (2009-08-01), Ishino et al.

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