Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2011-04-26

2011-04-26

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S108000, C257S668000

Reexamination Certificate

active

07932165

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, then etching the bumped terminal to expose the filler, then forming an insulative base, and then grinding the insulative base to expose the filler.

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