Electroless gold plating bath, electroless gold plating...

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

Reexamination Certificate

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C106S001260, C427S437000

Reexamination Certificate

active

07988773

ABSTRACT:
An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2or (CH2—NH—C2H4—NH—CH2)n—R4(wherein R1to R4represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.

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patent: 2008/0138506 (2008-06-01), Kiso et al.
patent: 2008/0138507 (2008-06-01), Kiso et al.
patent: 2008/0277140 (2008-11-01), Kurosaka et al.
patent: 2002-226975 (2002-08-01), None
patent: 2004-137589 (2004-05-01), None
patent: WO-2004/111287 (2004-12-01), None

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