Probe card repair using coupons with spring contacts and...

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

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C324S754090

Reexamination Certificate

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07876087

ABSTRACT:
Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate.

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