Detachable substrate with controlled mechanical strength and...

Details Detachable substrate with controlled mechanical strength and... Detachable substrate with controlled mechanical strength and...

2011-03-08

2011-03-08

Dickey, Thomas L (Department: 2826)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S958000, C257S629000, C257SE21568

Reexamination Certificate

active

07902038

ABSTRACT:
The invention relates to a method for production of a detachable substrate, comprising a method step for the production of an interface by means of fixing, using molecular adhesion, one face of a layer on one face of a substrate, in which, before fixing, a treatment stage for at least one of said faces is provided, rendering the mechanical hold at the interface at such a controlled level to be compatible with a subsequent detachment.

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