Method for fabricating a surface mounting type semiconductor chi

Details Method for fabricating a surface mounting type semiconductor chi Method for fabricating a surface mounting type semiconductor chi

1998-10-09

2000-12-19

Fahmy, Wael

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438613, 438614, H01L 2150, H01L 2144

Patent

active

061626643

ABSTRACT:
A solder structure for a surface mounting type semiconductor chip package, and a method of fabricating the same are disclosed. The surface mounting type semiconductor chip package includes a package body having an interconnection formed therein and a semiconductor chip accommodated therein, and a plurality of double layer bumps each attached to the bottom of the package body as an external connection terminal.

REFERENCES:
patent: 5633204 (1997-05-01), Tago et al.
patent: 5637832 (1997-06-01), Danner
patent: 5714803 (1998-02-01), Queyssac
patent: 5736790 (1998-04-01), Iyogi et al.
patent: 5753973 (1998-05-01), Yasunaga et al.
patent: 5920770 (1999-07-01), Yasunaga et al.

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