Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1998-12-11
2000-12-19
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438121, 438123, 438124, 438127, H01L 2144, H01L 2148, H01L 2150
Patent
active
061626627
ABSTRACT:
A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.
REFERENCES:
patent: 3566207 (1971-02-01), Adams
patent: 3685137 (1972-08-01), Gardiner
patent: 3708730 (1973-01-01), Schierz et al.
patent: 4030657 (1977-06-01), Scheffer
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4361261 (1982-11-01), Elles et al.
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4527730 (1985-07-01), Shirai et al.
patent: 4600138 (1986-07-01), Hill
patent: 4603803 (1986-08-01), Chan et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4765531 (1988-08-01), Ricketson et al.
patent: 4766478 (1988-08-01), Dennis
patent: 4778097 (1988-10-01), Hauser
patent: 4821945 (1989-04-01), Chase et al.
patent: 4978393 (1990-12-01), Maheas
patent: 4978835 (1990-12-01), Luijtjes et al.
patent: 5035034 (1991-07-01), Cotney
patent: 5062565 (1991-11-01), Wood et al.
patent: 5082165 (1992-01-01), Ishizuka
patent: 5114066 (1992-05-01), Amador et al.
patent: 5148959 (1992-09-01), Cain et al.
patent: 5193733 (1993-03-01), You
patent: 5197652 (1993-03-01), Yamazaki
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5238174 (1993-08-01), Ricketson et al.
patent: 5264002 (1993-11-01), Egashira et al.
patent: 5307929 (1994-05-01), Seidler
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5372972 (1994-12-01), Hayashi et al.
patent: 5384155 (1995-01-01), Abbott et al.
patent: 5420758 (1995-05-01), Liang
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5465899 (1995-11-01), Quick et al.
patent: 5647528 (1997-07-01), Ball et al.
H.K. Charles, Jr.; "Electrical Interconnection"; pp. 224-236. No Date.
Micro)n Technology, Inc.
Niebling John F.
Zarneke David A.
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