Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2011-04-19
2011-04-19
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257SE23101, C257SE21499, C257S712000, C257S713000, C257S717000, C257S720000, C257S675000
Reexamination Certificate
active
07928548
ABSTRACT:
A heat spreader attached to a heat source that includes a semiconductor chip includes a silicon structure that provides a plurality of heat flux paths, including a lateral, in-plane heat flux path. The heat spreader is mounted in-plane with the heat source.
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Bernstein Kerry
Sri-Jayantha Sri M.
International Business Machines - Corporation
McGinn IP Law Group PLLC
Williams Alexander O
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