Silicon heat spreader mounted in-plane with a heat source...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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Details

C257SE23101, C257SE21499, C257S712000, C257S713000, C257S717000, C257S720000, C257S675000

Reexamination Certificate

active

07928548

ABSTRACT:
A heat spreader attached to a heat source that includes a semiconductor chip includes a silicon structure that provides a plurality of heat flux paths, including a lateral, in-plane heat flux path. The heat spreader is mounted in-plane with the heat source.

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patent: 7391067 (2008-06-01), Kumar
patent: 7492041 (2009-02-01), Ravi et al.
patent: 7654311 (2010-02-01), Yang et al.
patent: 7695188 (2010-04-01), Sri-Jayantha et al.
patent: 2002/0063330 (2002-05-01), Macris
patent: 2002/0134419 (2002-09-01), Macris
patent: 2006/0260793 (2006-11-01), Yang et al.

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