Integrated circuit package system with overhanging...

Details Integrated circuit package system with overhanging... Integrated circuit package system with overhanging...

2011-01-04

2011-01-04

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C438S108000, C438S124000, C257S687000, C257S697000, C257S773000, C257S776000, C257SE21503

Reexamination Certificate

active

07863099

ABSTRACT:
An integrated circuit package system comprising: providing a first conductive line adjacent to a second conductive line; forming a first connection stack over the first conductive line with the first connection stack overhanging the second conductive line; connecting an integrated circuit device and the first connection stack; and encapsulating the integrated circuit device and the first connection stack.

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