Molding apparatus

Details Molding apparatus Molding apparatus

2011-07-19

2011-07-19

Ewald, Maria Veronica D (Department: 1744)

Plastic article or earthenware shaping or treating: apparatus

With apparatus assembly or dismantling means or with idle part

C425S193000, C425S195000, C425S408000, C425S808000, C249S102000

Reexamination Certificate

active

07980845

ABSTRACT:
A molding apparatus includes a first mold half, a first mold core, a second mold half, a second mold core and a plurality of spacers. The first mold core is received in the first mold half and has a first molding surface. The second mold half includes a receiving cavity defined therein and a plurality of parallel grooves angularly equidistantly spaced from each other. The second mold core is received in the receiving cavity and has a second molding surface facing the first molding surface. The first and second molding surfaces are configured for cooperatively defining a molding cavity therebetween. The spacers are configured for being selectively disposed in the corresponding grooves. Each spacer is configured for being sandwiched between the second mold half and the second mold core. The spacers are configured for aligning the second molding surface with the first molding surface.

REFERENCES:
patent: 4540534 (1985-09-01), Grendol
patent: 4861254 (1989-08-01), Takeuchi et al.
patent: 4911632 (1990-03-01), Mansfield
patent: 6120279 (2000-09-01), Vovan
patent: 6196824 (2001-03-01), Foltuz et al.
patent: 2003/0033833 (2003-02-01), Fujimoto et al.
patent: 2005/0212154 (2005-09-01), Inoue et al.

Affiliated with

Also associated with

Rating

Molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2700654