Packaged integrated circuit having gold removed from a lead...

Details Packaged integrated circuit having gold removed from a lead... Packaged integrated circuit having gold removed from a lead...

2011-06-07

2011-06-07

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S677000, C257S766000, C257S769000

Reexamination Certificate

active

07956445

ABSTRACT:
A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An integrated circuit die is attached to the lead frame. The gold layer is substantially removed from portions of the top surface of the lead frame. The integrated circuit die is wire bonded to the lead fingers with a plurality of wire stitches subsequent to substantially removing the gold. The die is encapsulated in a mold compound to form a packaged integrated circuit.

REFERENCES:
patent: 5013688 (1991-05-01), Yamazaki et al.
patent: 5166097 (1992-11-01), Tanielian
patent: 5914532 (1999-06-01), Akagi et al.
patent: 5929511 (1999-07-01), Nakazawa et al.
patent: 6194777 (2001-02-01), Abbott et al.
patent: 2006/0125062 (2006-06-01), Zuniga-Ortiz et al.

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