Electronic device including electronic component, heat...

Details Electronic device including electronic component, heat... Electronic device including electronic component, heat...

2011-03-22

2011-03-22

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S705000, C361S708000, C361S717000, C361S718000, C361S722000

Reexamination Certificate

active

07911795

ABSTRACT:
A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.

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