Multilayered printed circuit board

Details Multilayered printed circuit board Multilayered printed circuit board

2011-03-29

2011-03-29

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S795000, C174S255000

Reexamination Certificate

active

07916492

ABSTRACT:
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.

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