Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2011-04-19
2011-04-19
Webb, Gregory E (Department: 1761)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C134S001300
Reexamination Certificate
active
07928046
ABSTRACT:
Aqueous, silicate free, cleaning compositions of about pH 9 or below and method of using the cleaning compositions for cleaning microelectronic substrates, which compositions are able to essentially completely clean such substrates and produce essentially no metal corrosion of the metal elements of such substrates. The aqueous cleaning compositions of this invention have (a) water, (b) at least one of ammonium and quaternary ammonium ions and (c) at least one of hypophosphite (H2PO2−) and/or phosphite (HPO32−) ions. The cleaning compositions also may contain fluoride ions. Optionally, the composition may contain other components such as organic solvents, oxidizing agent, surfactants, corrosion inhibitors and metal complexing agents.
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Ilardi Joseph M.
Kane Sean M.
Skee David C.
Trovalli Karen E.
Avantor Performance Materials, Inc.
Ohlandt Greeley Ruggiero & Perle LLP
Rauchfuss, Jr. George W.
Webb Gregory E
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