Temperature measuring device and method for measuring...

Details Temperature measuring device and method for measuring... Temperature measuring device and method for measuring...

2011-04-12

2011-04-12

Paschall, Mark H (Department: 3742)

Electric heating

Heating devices

With power supply and voltage or current regulation or...

C219S501000, C219S209000, C156S345270, C257S713000, C257S717000, C374S120000

Reexamination Certificate

active

07923665

ABSTRACT:
An object of the present invention is to provide a wafer-type thermometer capable of adapting itself to automation and improving the heat resistance to measure temperature distribution of a wafer and a method for manufacturing the wafer-type thermometer. A plurality of temperature sensors are arranged in regions formed by segmenting the upper surface of a wafer into a plurality of regions. Output signals from the plurality of temperature sensors are converted into temperature data by a conversion processing circuit where further processes the temperature data. The conversion processing circuit is housed in a storage room surrounded by a heat insulating member made of a nanocrystalline silicon layer.

REFERENCES:
patent: 5994679 (1999-11-01), DeVeau et al.
patent: 7646135 (2010-01-01), Churchill et al.
patent: 2001/0040154 (2001-11-01), Hashimoto et al.
patent: 2004/0000713 (2004-01-01), Yamashita et al.
patent: 2008/0031305 (2008-02-01), Kobayashi
patent: 2002-124457 (2002-04-01), None
patent: 2004-024551 (2004-01-01), None

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