Method of providing a RF shield of an electronic device

Details Method of providing a RF shield of an electronic device Method of providing a RF shield of an electronic device

2011-07-05

2011-07-05

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000, C257S734000

Reexamination Certificate

active

07971350

ABSTRACT:
A shielding assembly is configured to provide electromagnetic shielding and environmental protection to one or more electronic components coupled to a substrate. The shielding assembly includes a non-conductive mold compound layer, such as a dielectric epoxy. The mold compound layer is applied to a top surface of the substrate, thereby covering the electronic components and providing protection against environmentally induced conditions such as corrosion, humidity, and mechanical stress. The shielding assembly also includes a conductive layer applied to a top surface of the mold compound layer. The conductive layer is coupled to a ground plane in the substrate, thereby enabling the electromagnetic shielding function. The conductive layer is coupled to the ground plane via one or more metallized contacts that are coupled to the substrate and extend through the mold compound layer.

REFERENCES:
patent: 4703133 (1987-10-01), Miller
patent: 7187060 (2007-03-01), Usui
patent: 2004/0178500 (2004-09-01), Usui
patent: 2007/0163802 (2007-07-01), Monthei

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