Encapsulant composition and method for fabricating...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C522S071000, C522S083000, C522S170000, C522S172000, C522S182000

Reexamination Certificate

active

07932301

ABSTRACT:
An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1˜15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided.

REFERENCES:
patent: 4328325 (1982-05-01), Marquardt et al.
patent: 5340420 (1994-08-01), Ozimek et al.
patent: 6099783 (2000-08-01), Scranton et al.
patent: 6129955 (2000-10-01), Papathomas et al.
patent: 6133522 (2000-10-01), Kataoka et al.
patent: 7205718 (2007-04-01), Cok
patent: 7261795 (2007-08-01), Wilkinson et al.
patent: 2003/0114556 (2003-06-01), Jennrich et al.
patent: 2004/0187999 (2004-09-01), Wilkinson et al.
patent: 2005/0158480 (2005-07-01), Goodwin et al.
patent: 2006/0135705 (2006-06-01), Vallance et al.
patent: 2006/0223978 (2006-10-01), Kong
patent: 2007/0049655 (2007-03-01), Yoshimune et al.
patent: 2007/0178629 (2007-08-01), Ogawa et al.
patent: 2007/0190693 (2007-08-01), Lee et al.
patent: 0 969 058 (2000-01-01), None
patent: 1502922 (2005-02-01), None
patent: 1 911 579 (2008-04-01), None
patent: 2000-061974 (2000-02-01), None
patent: 2005187799 (2005-07-01), None
patent: WO 2007/120197 (2007-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Encapsulant composition and method for fabricating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulant composition and method for fabricating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulant composition and method for fabricating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2687259

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.