Integrated circuit die with logically equivalent bonding pads

Details Integrated circuit die with logically equivalent bonding pads Integrated circuit die with logically equivalent bonding pads

2011-01-04

2011-01-04

Smith, Matthew A (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S109000, C257S686000, C257SE21001, C257SE23116, C257S680000, C257SE21499

Reexamination Certificate

active

07863093

ABSTRACT:
An integrated circuit (IC) die includes two bonding pads, that share a common logical function, such as signal input or signal output, separated by the width of the die, and preferably on opposite sides of the die. System-in-package devices are produced by steps including directly electrically connecting one or the other bonding pad to bonding pads of other, functionally different IC dies, with the bonding pads of the other IC dies, to which are connected bonding pads of common logical function of the IC dies of the present invention, being functionally identical but geometrically different. Multichip package devices are produced by stacking the IC dies of the present invention with other IC dies and directly electrically connecting one or the other bonding pad to different bonding pads of the other IC dies.

REFERENCES:
patent: 4093992 (1978-06-01), Kawamura et al.
patent: 4703483 (1987-10-01), Enomoto et al.
patent: 5631492 (1997-05-01), Ramus et al.
patent: 5744870 (1998-04-01), Casper
patent: 5874931 (1999-02-01), Drake et al.
patent: 5969538 (1999-10-01), Whetsel
patent: 6114878 (2000-09-01), Loughmiller et al.
patent: 6232668 (2001-05-01), Hikita et al.
patent: 6417695 (2002-07-01), Duesman
patent: 6815807 (2004-11-01), Corisis
patent: 6833620 (2004-12-01), Rosefield et al.
patent: 6979905 (2005-12-01), Nishida et al.
patent: 2006/0087013 (2006-04-01), Hsieh
patent: 2006/0097284 (2006-05-01), Ronen
patent: 2007/0222055 (2007-09-01), Jensen et al.

Affiliated with

Also associated with

Rating

Integrated circuit die with logically equivalent bonding pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit die with logically equivalent bonding pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit die with logically equivalent bonding pads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2687239