Multi-chip systems with optical bypass

Details Multi-chip systems with optical bypass Multi-chip systems with optical bypass

2011-01-04

2011-01-04

Sedighian, M. R. (Department: 2613)

Optical communications

Transmitter and receiver system

Including optical circuit board

C398S140000, C398S165000

Reexamination Certificate

active

07865084

ABSTRACT:
Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.

REFERENCES:
patent: 4699449 (1987-10-01), Lam et al.
patent: 6668106 (2003-12-01), Levine et al.
patent: 2004/0197046 (2004-10-01), Drost et al.
patent: 2005/0285214 (2005-12-01), Krishnamoorthy
patent: 2006050446 (2006-05-01), None
patent: WO 2006/050446 (2006-05-01), None
Zheng, Xuezhe et al., “Optical Transceiver Chips Based on Co-Integration of Capacitively Coupled Proximity Interconnects and VCSELs”, pp. 453-455, IEEE Photonics Technology Letters, vol. 19, No. 7, Apr. 1, 2007.

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