Melting temperature adjustable metal thermal interface...

Details Melting temperature adjustable metal thermal interface... Melting temperature adjustable metal thermal interface...

2011-05-31

2011-05-31

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S717000, C257SE23110

Reexamination Certificate

active

07952192

ABSTRACT:
A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C.

REFERENCES:
patent: 6791839 (2004-09-01), Bhagwagar
patent: 2007/0228109 (2007-10-01), Smith et al.

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