Method and system for measuring film stress in a wafer film

Details Method and system for measuring film stress in a wafer film Method and system for measuring film stress in a wafer film

Filed on

2011-08-23

Date issued

2011-08-23

Examiner

Hollington, Jermele M (Department: 2858)

Patent Class

Electricity: measuring and testing

SubClass

Fault detecting in electric circuits and of electric components

SubSubClass

Of individual circuit component or element

Type

Reexamination Certificate

Status

active

Patent number

08004303

Description

ABSTRACT:
In a MEMS wafer, film stresses are measured by placing an inductor array over or under the wafer and measuring inductance variations across the array to obtain a map defining the amount of bowing of the wafer.

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