Method of encapsulating a molded ceramic member

Details Method of encapsulating a molded ceramic member Method of encapsulating a molded ceramic member

1978-08-03

1980-10-28

Lusignan, Michael R.

Coating processes

Coating by vapor, gas, or smoke

Base supplied constituent

427255, 427294, 427344, C23C 1100, C23C 1300, B05D 300

Patent

active

042307457

ABSTRACT:
For the encapsulation of a molded ceramic member for high-temperature isostatic pressing, the molded member, which preferably is of silicon ceramic, is covered with a dense surface coating of an Si melt. Thereafter, the coating is exposed to an N.sub.2 atmosphere at a temperature of within about 800.degree. to 1400.degree. C. for so long until the Si coating is converted into a Si.sub.3 N.sub.4 coating.

REFERENCES:
patent: 2618565 (1952-11-01), Nicholson
patent: 3503798 (1970-03-01), Yoshioka et al.
patent: 3520722 (1970-07-01), Scott
patent: 3928662 (1975-12-01), Kaneko et al.
Milek, John T., Silicon Nitride for Microelectronic Applications, 1971.

Affiliated with

Also associated with

Rating

Method of encapsulating a molded ceramic member does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of encapsulating a molded ceramic member, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulating a molded ceramic member will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-268323