Furnace transient anneal process

Metal treatment – Compositions – Heat treating

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29576B, 29576T, 118500, 118641, 118724, 118728, 148DIG3, 148DIG6, 148DIG71, 148DIG76, 219385, 219390, 432 11, 432 45, 432148, 432198, H01L 21324, H01L 21265

Patent

active

045552738

ABSTRACT:
A method for annealing semiconductor samples, especially following ion-implantation of semiconductor samples is disclosed. A furnace on a set of rails is passed over the semiconductor sample which is supported on a stationary wire basket made of low thermal mass, fine tungsten wire. The furnace temperature may be about 5.degree. above the desired anneal temperature of the semiconductor sample such that the sample temperature rises to within a few degrees of the furnace temperature within seconds. Utilizing the moveable furnace insures uniform heating without elaborate temperature control or expensive beam generating equipment.
The apparatus and process of the present invention are utilized for rapid annealing of ion-implanted indium phosphide semiconductors within 10 to 30 seconds and at temperatures of approximately 700.degree. C., thereby eliminating undesired and damaging movement of impurities within the ion-implanted InP.

REFERENCES:
patent: 2992903 (1961-07-01), Imber
patent: 3723053 (1973-03-01), Myers et al.
patent: 3734693 (1973-05-01), Petcoff
patent: 4347431 (1982-08-01), Pearce et al.
patent: 4357180 (1982-11-01), Molnar
Grochowski et al., "Slow Cooling to Minimize Distortion . . . " I.B.M. Te Discl. Bull., vol. 14, No. 5, Oct. 1971, p. 1640.
Edel et al., "Capsule Cooling Following Diffusion" I.B.M. Tech. Discl. Bull., vol. 15, No. 6, Nov. 1972, p. 1967.

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