Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Mechanical measurement system
Reexamination Certificate
2011-06-21
2011-06-21
Teixeira Moffat, Jonathan C (Department: 2857)
Data processing: measuring, calibrating, or testing
Measurement system in a specific environment
Mechanical measurement system
C356S035500, C073S760000
Reexamination Certificate
active
07966135
ABSTRACT:
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
REFERENCES:
patent: 5555471 (1996-09-01), Xu et al.
patent: 5710631 (1998-01-01), Bou-Ghannam et al.
patent: 6031611 (2000-02-01), Rosakis et al.
patent: 6268883 (2001-07-01), Zehnder et al.
patent: 6469788 (2002-10-01), Boyd et al.
patent: 6513389 (2003-02-01), Suresh et al.
patent: 6600565 (2003-07-01), Suresh et al.
patent: 6781702 (2004-08-01), Giannakopoulos et al.
patent: 6924497 (2005-08-01), Suresh et al.
patent: 7363173 (2008-04-01), Rosakis et al.
patent: 7418353 (2008-08-01), Lovell et al.
patent: 7487050 (2009-02-01), Rosakis et al.
patent: 7538891 (2009-05-01), Mello et al.
patent: 2002/0012122 (2002-01-01), Boyd et al.
patent: 2003/0086156 (2003-05-01), McGuire, Jr.
patent: 2003/0106378 (2003-06-01), Giannakopoulos et al.
patent: 2003/0190131 (2003-10-01), Barth
patent: 2004/0075825 (2004-04-01), Suresh et al.
patent: 2004/0257587 (2004-12-01), Rosakis et al.
patent: 2005/0007601 (2005-01-01), Rosakis et al.
patent: 2005/0030551 (2005-02-01), Rosakis et al.
patent: 2005/0278126 (2005-12-01), Rosakis et al.
patent: 2006/0276977 (2006-12-01), Rosakis et al.
patent: 05-335217 (1993-12-01), None
Brown, M., et al., “A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film-Substrate Systems,”Journal of Applied Mechanics, 73(5):723-729, Sep. 2006.
Feng, X., et al., “On the Stoney Formula for a Thin Film/Substrate System With Non-Uniform Substrate Thickness,”Journal of Applied Mechanics, 74(6):1276-1281, Nov. 2007.
Finot, M., et al., “Large deformation and geometric instability of substrates with thin-film deposits”,J. Appl. Phys., 81(8):3457-3464, Apr. 1997.
Finot, M., et al., “Small and large deformation of thick and thin-film multi-layers: Effect of layer geometry, plasticity and compositional gradients”,J. Mech. Phys. Solids, 44(5):683-721, May 1996.
Freund, L.B., “Substrate curvature due to thin film mismatch strain in the nonlinear deformation range”,J. Mech. Phys. Solids, 48(6-7):1159-1174, Jun. 2000.
Huang, Y. et al., “Non-uniform, axisymmetric misfit strain in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures”,Acta Mechanica Sinica, 21(4):362-370, Aug. 2005.
Huang, Y., et al., “Extension of Stoney's formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry”,J. Mech. Phys. Solids, 53(11):2483-2500, Nov. 2005.
Lee, H., et al., “Full-field optical measurement of curvatures in ultra-thin-film-substrate systems in the range of geometrically nonlinear deformations”,J. Appl. Phys., 89(11):6116-6129, Jun. 2001.
Masters, C.B., et al., “Geometrically nonlinear stress-deflection relations for thin film/substrate systems”,Int. J. Eng. Sci, 31(6):915-925, (1993).
Ngo, D., et al., “Thin Film/Substrate Systems Featuring Arbitrary Film Thickness and Misfit Strain Distributions. Part I: Analysis for Obtaining Film Stress from Non-Local Curvature Information,”International Journal of Solids and Structures, 44(6):1745-1754, Mar. 2007.
Park, T.-S., et al., “Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines”,Acta Materialia, 48(12):3169-3175, Jul. 2000.
Park, T.-S., et al., “Measurement of full-field curvature and geometrical instability of thin film-substrate systems through CGS interferometry”,J. Mech. Phys. Solids, 51(11-12):2191-2211, Nov.-Dec. 2003.
Rosakis, A.J., et al., “Full field measurements of curvature using coherent gradient sensing: application to thin film characterization”,Thin Solid Films, 325(1-2):42-54, Jul. 1998.
Salamon, A.J., et al., “Bifurcation in isotropic thin film/substrate plates”,Int. J. Solids Structures, 32(3):473-481, Feb. 1995.
Shen, Y.L., et al., “Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers”,J. Appl. Phys., 80(3):1388-1398, Aug. 1996.
Stoney, G.G., “The tension of metallic films deposited by electrolysis”,Proceedings of the Royal Society of London, 82(553):172-175, May 1909.
Wikstrom, A., et al., “Analysis of average thermal stresses in passivated metal interconnects”,J. Appl. Phys., 86(11):6088-6095, Dec. 1999.
Wikstrom, A., et al., “Thermoelastic Analysis of Periodic Thin Lines Deposited on a Substrate”,J. Mech. Phys. Solids, 47(5):1113-1130, Apr. 1999.
Brown, M.A., et al., “Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. Part II: Experimental validation of the non-local stress/curvature relations,” International Journal of Solids and Structures, 44 (6):1755-1767, Mar. 2007.
Feng, X., et al., “Multi-layer thin films/substrate system subjected to non-uniform misfit strains,” International Journal of Solids and Structures, 45(13):3688-3698, Jun. 2008.
Feng, X., et al., “Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature,” Journal of Applied Mechanics, 75(2):021022.1-021022.7, Mar. 2008.
Feng, X., et al., “The effect of thin film/substrate radii on the Stoney formula for thin film/substrate subjected to non-uniform axisymmetric misfit strain and temperature,” Journal of Mechanics of Materials and Structures, 1 (6):1041-1053, Jun. 2006.
Huang, Y., et al., “Anisotropic, non-uniform misfit strain in a thin film bonded on a plate substrate,” Interaction and Multiscale Mechanics, 1(1):123-142, (2007).
Huang, Y., et al., “Extension of Stoney's Formula to Arbitrary Temperature Distributions in Thin Film/Substratee Systems,” Journal of Applied Mechanics, 74(6):1225-1233, Nov. 2007.
Ngo, D., et al., “Spatially non-uniform, isotropic misfit strain in thin films bonded on plate substrates: The relation between non-uniform film stresses and system curvatures,” Thin Solid Films, 515(4):2220-2229, Dec. 2006.
Huang Yonggang
Rosakis Ares J.
California Institute of Technology
Perkins Coie LLP
Teixeira Moffat Jonathan C
LandOfFree
Characterizing curvatures and stresses in thin-film... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Characterizing curvatures and stresses in thin-film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Characterizing curvatures and stresses in thin-film... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2680670