Semiconductor device and method for cutting electric fuse

Details Semiconductor device and method for cutting electric fuse Semiconductor device and method for cutting electric fuse

2011-08-02

2011-08-02

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S209000, C257S249000, C257S665000, C257SE23149

Reexamination Certificate

active

07989913

ABSTRACT:
An electric fuse includes: a first interconnect and a second interconnect, formed on a semiconductor substrate; a fuse link, formed on the semiconductor substrate and provided so that an end thereof is coupled to the first interconnect, the fuse link being capable of electrically cutting the second interconnect from the first interconnect; and an electric current inflow terminal and an electric current drain terminal for cutting the fuse link, formed on the semiconductor substrate and provided in one end and another end of the first interconnect, respectively.

REFERENCES:
patent: 4064493 (1977-12-01), Davis
patent: 2004/0262710 (2004-12-01), Ueda
patent: 2005/0179062 (2005-08-01), Kajita
patent: 2005/0285222 (2005-12-01), Thei et al.
patent: 2004-186590 (2004-07-01), None
patent: 2004-214580 (2004-07-01), None
patent: 2005-39220 (2005-02-01), None
patent: 2005-57186 (2005-03-01), None
Chinese Office Action in the corresponding Chinese patent application 200710103283.2, issued on Oct. 24, 2008.

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