Copper coating of printed circuit boards

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

106 1405, 216 13, 252 792, 252 794, 427123, 427327, B05D 512

Patent

active

058008594

ABSTRACT:
A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surfactant.

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