Methods of and apparatus for inspecting substrate

Details Methods of and apparatus for inspecting substrate Methods of and apparatus for inspecting substrate

2011-01-11

2011-01-11

Yuan, Kathleen S (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S199000, C382S286000, C348S087000, C029S739000

Reexamination Certificate

active

07869644

ABSTRACT:
Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.

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