Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-01-18
2011-01-18
Geyer, Scott B (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S738000, C257S773000, C257S783000
Reexamination Certificate
active
07872347
ABSTRACT:
Methods, systems, and apparatuses for integrated circuit packages, and processes for forming the same, are provided. In one example, an integrated circuit (IC) package includes an integrated circuit die, a layer of insulating material, a redistribution interconnect on the layer of insulating material, and a ball interconnect. The integrated circuit die has a plurality of terminals on a first surface. The insulating material covers the first surface of the die and fills a space adjacent to one or more sides of the die. The redistribution interconnect has a first portion coupled to a terminal of the die through the first layer, and a second portion that extends away from the first portion over the insulating material filling the space adjacent to the die. The ball interconnect is coupled to the second portion of the redistribution interconnect.
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Broadcom Corporation
Fiala & Weaver P.L.L.C.
Geyer Scott B
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