Method and apparatus for wafer level burn-in

Details Method and apparatus for wafer level burn-in Method and apparatus for wafer level burn-in

2011-05-10

2011-05-10

Nguyen, Ha Tran T (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S750050, C324S750060, C324S750280

Reexamination Certificate

active

07940064

ABSTRACT:
A temperature regulation plate106is divided into at least two areas, a heater408for applying a temperature load in correspondence with such areas and its control system are divided and controlled independently to set temperatures, and a cooling source is controlled by comparing the measurements from temperature sensors409arranged in respective areas for controlling the heater408and switching the measurement for calculating the control output sequentially thus reducing variation in in-plane temperature of a wafer due to heating when an electric load is applied. Since consumption and burning of a probe are prevented, highly reliable wafer level burn-in method and apparatus can be provided.

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