Method for detecting position of defect on semiconductor wafer

Details Method for detecting position of defect on semiconductor wafer Method for detecting position of defect on semiconductor wafer

2011-01-25

2011-01-25

Toatley, Gregory J (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

Reexamination Certificate

active

07876432

ABSTRACT:
A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light beam reflected from a surface of the semiconductor wafer with a second detecting device; detecting an alignment part based on a detected result by the second detecting device to determine a position of the alignment part; and detecting a defect based on the detected result by the second detecting device to determine a position of the defect.

REFERENCES:
patent: 2005/0062960 (2005-03-01), Tsuji et al.
patent: 08-279547 (1996-10-01), None
patent: 2003-258062 (2003-09-01), None

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