Body to be plated, method of determining plated film...

Details Body to be plated, method of determining plated film... Body to be plated, method of determining plated film...

2011-01-25

2011-01-25

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C438S015000, C438S123000, C029S825000

Reexamination Certificate

active

07875468

ABSTRACT:
A structure to be plated includes a body to be plated11on which plating is formed, and plated film thickness determining member16opposed to and electrically isolated from the body to be plated11through a slit portion12. The plated film thickness determining member16has an islands-shape and is conductive. It is possible to instantly determine whether or not the plating formed on the body to be plated11has been formed to a thickness larger than the width W of the slit portion12on the spot by determining whether or not plating has grown from the surface of the body to be plated11to the plated film thickness determining member16through the slit portion21.

REFERENCES:
patent: 56-083936 (1981-07-01), None

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