Circuit for detecting bonding defect in multi-bonding wire

Details Circuit for detecting bonding defect in multi-bonding wire Circuit for detecting bonding defect in multi-bonding wire

2011-06-14

2011-06-14

Tang, Minh N (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S762010, C324S762030

Reexamination Certificate

active

07960983

ABSTRACT:
An integrated circuit for detecting a bonding defect in a multi-bonding wire. The integrated circuit includes a plurality of pads each connectable by a bonding wire to a lead terminal. Voltage supplied to the lead terminal is applied in common to the plurality of pads. A detection circuit is operably connected to the plurality of pads. The detection circuit detects breakage of the bonding wires based on potentials at the plurality of pads.

REFERENCES:
patent: 5635822 (1997-06-01), Marchio et al.
patent: 6410936 (2002-06-01), Hongo
patent: 2005-331516 (2005-12-01), None

Affiliated with

Also associated with

Rating

Circuit for detecting bonding defect in multi-bonding wire does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit for detecting bonding defect in multi-bonding wire, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit for detecting bonding defect in multi-bonding wire will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2661920