Microelectronic assemblies having compliant layers

Details Microelectronic assemblies having compliant layers Microelectronic assemblies having compliant layers

2011-01-18

2011-01-18

Parker, Kenneth A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S685000, C257S686000, C257S668000, C257S688000, C257S777000, C257S693000, C257S678000, C257S661000, C257S784000, C257S788000

Reexamination Certificate

active

07872344

ABSTRACT:
A compliant semiconductor chip package assembly includes a a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.

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