Method for cooling an integrated circuit die with coolant...

Details Method for cooling an integrated circuit die with coolant... Method for cooling an integrated circuit die with coolant...

2011-06-07

2011-06-07

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S704000, C361S705000

Reexamination Certificate

active

07957137

ABSTRACT:
A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.

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