Semiconductor device having through contacts through a...

Details Semiconductor device having through contacts through a... Semiconductor device having through contacts through a...

2011-05-17

2011-05-17

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S774000, C257S778000, C257SE23011

Reexamination Certificate

active

07944061

ABSTRACT:
The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

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Richard R.A. Syms et al., “Surface Tension-Powered Self-Assembly of Microstructures—The State-of-the-Art”, Journal of Microelectromechanical Systems, vol. 12, No. 4, Aug. 2003.

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