Method for manufacturing nonreciprocal circuit device and...

Details Method for manufacturing nonreciprocal circuit device and... Method for manufacturing nonreciprocal circuit device and...

2011-05-10

2011-05-10

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S601000, C029S592100, C257S688000, C438S117000

Reexamination Certificate

active

07937824

ABSTRACT:
A method for manufacturing a nonreciprocal circuit device in which a ferrite-magnet device including ferrite having first and second center electrodes arranged to intersect and be electrically insulated from each other and a pair of permanent magnets fixed to both principal surfaces of the ferrite so as to apply a direct current magnetic field to the ferrite is solder-bonded to a surface of a substrate. The ferrite-magnet device is solder-bonded to the surface of the substrate while a magnetic plate is disposed on a back surface of the substrate.

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Official Communication issued in corresponding Japanese Patent Application No. 2008-137980, mailed on Apr. 13, 2010.

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