Abrasive tool making process – material – or composition – With inorganic material
Patent
1997-07-17
1998-09-01
Jones, Deborah
Abrasive tool making process, material, or composition
With inorganic material
51308, 51309, 106 3, 252 792, 252 794, C09G 102
Patent
active
058005773
ABSTRACT:
A polishing composition for chemical mechanical polishing which comprises a carboxylic acid, an oxidizing agent, and water and has pH adjusted to 5 to 9 with an alkali. In chemical mechanical polishing for obtaining a high precision surface, particularly in chemical mechanical polishing for forming a circuit layer in production of semiconductor devices, the polishing composition shows a high polishing rate, has a high selectivity for circuit materials from insulation films, forms few corrosion marks or dishing, has neutral pH, does not contain any metal components which adversely affect properties of semiconductor devices, does not require any special expensive chemical agents, and does not comprise any substances harmful for human health as the main component.
REFERENCES:
patent: 4992135 (1991-02-01), Doan
patent: 5112513 (1992-05-01), Bressel et al.
patent: 5472630 (1995-12-01), Ouyang et al.
Jones Deborah
Showa Denko K.K.
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