Vapor vortex heat sink

Power plants – Motive fluid energized by externally applied heat – Process of power production or system operation

Reexamination Certificate

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C060S670000

Reexamination Certificate

active

07980078

ABSTRACT:
A hermetic Rankine cycle in a sealed casing powers an internal centrifugal condensate pump with an internal vapor turbine during forced convective heat transfer between a heat source and a heat sink. No work is imported into the cycle during operation. A centrifugal pumping disk shears the working fluid against a heating surface, sweeping evolving vapor into radial vortices which provide sink flow conduits to a vapor space at the center of the cylindrical turbine. Convective mass flow through the vapor space to the condensing end of the casing spins the turbine and the centrifugal pumping disk which is connected to it. Vapor is continuously swept from the heating surface, so bubbles do not form and superheat while blocking heat flux into liquid working fluid. Vapor is sucked through the radial vortices into the central vapor space and into the condensing end of the casing along the low pressure gradients in vortex cores established by cooling power. A high heat flux surface is thereby thermally connected to a conventional heat sink having high cooling power, for maximal heat extraction at data centers or other heat sources. Vapor vortices organize counterflow of vapor and condensate in a continuous mass flow cycle, and extract work from heat. Organic working fluids can be used in the casing to make even low temperature waste heat a power source.

REFERENCES:
patent: 1952281 (1934-03-01), Ranque
patent: 3894395 (1975-07-01), Laing
patent: 3922871 (1975-12-01), Bolesta
patent: 3982378 (1976-09-01), Sohre
patent: 3999400 (1976-12-01), Gray
patent: 4037414 (1977-07-01), Nicodemus
patent: 4333017 (1982-06-01), O'Connell
patent: 4362020 (1982-12-01), Meacher et al.
patent: 4367629 (1983-01-01), Cann
patent: 4479354 (1984-10-01), Cosby
patent: 4884169 (1989-11-01), Cutchaw
patent: 5137681 (1992-08-01), Dougherty
patent: 5263536 (1993-11-01), Hulburd et al.
patent: 5329771 (1994-07-01), Kytomaki et al.
patent: 5390077 (1995-02-01), Paterson
patent: 5441102 (1995-08-01), Burward-Hoy
patent: 5570579 (1996-11-01), Larjola
patent: 5611214 (1997-03-01), Wegeng et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6064572 (2000-05-01), Remsburg
patent: 6208512 (2001-03-01), Goldowsky et al.
patent: 6484503 (2002-11-01), Raz
patent: 6494935 (2002-12-01), Cho et al.
patent: 6516617 (2003-02-01), Schwieger
patent: 6550531 (2003-04-01), Searls et al.
patent: 6751959 (2004-06-01), McClanahan et al.
patent: 6856037 (2005-02-01), Yazawa et al.
patent: 6894899 (2005-05-01), Wu et al.
patent: 6943461 (2005-09-01), Kaploun
patent: 6945314 (2005-09-01), Farrow et al.
patent: 6986251 (2006-01-01), Radcliff et al.
patent: 7002800 (2006-02-01), Elias et al.
patent: 7035104 (2006-04-01), Meyer
patent: 7055581 (2006-06-01), Roy
patent: 7121906 (2006-10-01), Sundel
patent: 7140197 (2006-11-01), Chordia et al.
patent: 7263836 (2007-09-01), Gunawardana et al.
patent: 7310232 (2007-12-01), Touzov
patent: 7331379 (2008-02-01), Chen et al.
patent: 7352577 (2008-04-01), Chen et al.
patent: 7352580 (2008-04-01), Tsai
patent: 2007/0163754 (2007-07-01), Dionne et al.
US 7,352,579, 04/2008, Herring et al. (withdrawn)
A. Bergles, “The Implications and Challenges of Enhanced Heat Transfer for the Chemical Process Industries,” Trans IChemE, May 2001, pp. 437-444, vol. 79, Part A., Institution of Chemical Engineers.
J. Bintoro et al., “A Closed-Loop Electronics Cooling by Implementing Single Phase Impinging Jet and Mini Channels Heat Exchanger,” Applied Thermal Engineering, 2005, pp. 2740-2753, vol. 25.
M. Ellsworth, Jr. et al., “High Powered Chip Cooling—Air and Beyond,” Electronics Cooling, Aug. 2005, vol. 11, No. 3, http://www.electonics-cooling.com/articles/2005/2005—august—article1.php.
C. Gao, “Experimental Study of the Ranque-Hilsch Vortex Tube,” 2005, Eindhoven, http://alexandria.tue.nl/extra2/200513271.pdf.
E. Granryd et al., Refrigerating Engineering, 2005, pp. 8:18-8:25, Stockholm, http://www.energy.kth.se/courses/4a1601/Files/Pool%20boiling.pdf.
Honeywell, Genetron 245fa Applications Development Guide.
Promvonge et al., “Investigation on the Vortex Thermal Separation in a Vortex Tube Refrigerator,” ScienceAsia 31, 2005, pp. 215-223.
L. Swanson, “Heat Pipes,” CRC Handbook of Mechanical Engineering, 1998, pp. 4-260-261, 4-272.
J. Titus, “Liquid Cooler Chill Out,” ECN Magazine, Oct. 2007, pp. 31-36.
M. Vogel et al., “Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs,” Electronics Cooling, Feb. 2005, vol. 11, No. 1, http://www.electronics-cooling.com/articles/2005/2005—feb—a2.php.
Lee et al., “Mechanical Energy from Low Temperature Heat using ORCS”, Air Conditioning and Refrigeration Engineering, 1989, vol. 18, No. 1, pp. 29-35.
International Search Report and Written Opinion corresponding to International Application No. PCT/US2009/038543 dated Nov. 12, 2009.

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