Substrate cleaning apparatus and substrate cleaning method

Cleaning and liquid contact with solids – Apparatus – With means to movably mount or movably support the work or...

Reexamination Certificate

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C134S186000, C134S902000

Reexamination Certificate

active

07958899

ABSTRACT:
At a vibration applying position, ultrasonic vibration is applied upon a liquid film which is on a surface of a substrate. Concurrently with this, at a drop arrival position which is different from the vibration applying position, drops of a cleaning liquid are supplied to the liquid film, whereby wave-generating vibration which is different from the ultrasonic vibration is applied upon the liquid film. This dramatically improves removal of particles adhering to the surface of the substrate as compared with mere application of ultrasonic vibration. Hence, even when the output, the frequency and the like of the ultrasonic vibration are set to such an extent not damaging the substrate, it is possible to effectively remove particles with the wave-generating vibration and favorably clean the surface of the substrate.

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Office Action issued May 28, 2010 in connection with corresponding Korean Patent Application No. 2008-74961.

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