Multi-layer printed wiring board and manufacturing method...

Details Multi-layer printed wiring board and manufacturing method... Multi-layer printed wiring board and manufacturing method...

2011-08-23

2011-08-23

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

08003896

ABSTRACT:
A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer insulation layer, and a second filled via formed in the second interlayer insulation layer. The first filled via has a bottom portion having a first diameter. The second filled via has a bottom portion having a second diameter smaller than the first diameter.

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U.S. Appl. No. 11/832,892, filed Aug. 2, 2007, Wu.

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